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Effect of Ramping-Up Rate on Film Thickness for Spin-On Processing

Descriptive

TypeOfResource
Text
TitleInfo
Title
Effect of Ramping-Up Rate on Film Thickness for Spin-On Processing
Name (type = personal)
NamePart (type = family)
Birnie
NamePart (type = given)
Dunbar P.
Affiliation
Materials Science and Engineering, Rutgers University
Role
RoleTerm (authority = marcrt); (type = text)
author
Name (type = personal)
NamePart (type = family)
Hau
NamePart (type = given)
Steven K.
Affiliation
University of Arizona
Role
RoleTerm (authority = marcrt); (type = text)
author
Name (type = personal)
NamePart (type = family)
Kamber
NamePart (type = given)
Derrick S.
Affiliation
University of Arizona
Role
RoleTerm (authority = marcrt); (type = text)
author
Name (type = personal)
NamePart (type = family)
Kaz
NamePart (type = given)
David M.
Affiliation
University of Arizona
Role
RoleTerm (authority = marcrt); (type = text)
author
Name (authority = RutgersOrg-Department); (type = corporate)
NamePart
Materials Science and Engineering
Name (authority = RutgersOrg-School); (type = corporate)
NamePart
School of Engineering
Genre (authority = RULIB-FS)
Article, Refereed
Genre (authority = NISO JAV)
Accepted Manuscript (AM)
Note (type = version identification)
This is the Author's accepted manuscript of an article published in Journal of Materials Science: Materials in Electronics. The final publication is available at Springer via http://dx.doi.org/10.1007/s10854-005-4973-6
Note (type = peerReview)
Peer reviewed
OriginInfo
DateCreated (encoding = w3cdtf); (keyDate = yes); (qualifier = inferred)
2005
Abstract
Spin-on processing is used in many industries to deposit very thin coatings on flat substrates, including silicon wafers, flat-panel displays, and precision optical components. A liquid precursor solution is first dispensed onto the surface of the substrate; this fluid then spreads out very evenly over the surface due to large rotational forces caused by spinning of the substrate. When looking for an optimum coating procedure process engineers can adjust many variables including the peak spin speed, the ramping rate to reach that speed, the spinning time, as well as allowing for dynamic solution dispense before ramping up, though most protocols focus on the peak spin speed as the primary controlling variable. Engineers often construct spin-speed versus thickness correlations that enable predictable adjustment of spin-speed to achieve a desired thickness. Yet, rather little attention has been paid to the importance of the acceleration rate used to reach the desired peak speed. We show here that ramping rate is also important in helping establish the final coating thickness. We present a numerical model of the fluid flow on a spinning wafer when the spin-speed is ramping linearly up to a desired peak speed and then held constant. It is shown that the coating may “set” into its final thickness before the spin-speed reaches its peak value. In these cases then the peak spin-speed parameter is no longer the primary variable that defines the final coating thickness. This also impacts the interpretation of critical exponents found when fitting spin-speed vs. thickness data. We perform parallel experimental measurements for different ramping-up times and confirm the results from the numerical model. Both experimental and theoretical results support use of the simplified model put forth by Meyerhofer over 25 years ago (J. Appl. Phys. 49 (1978) 3993-3997).
Language
LanguageTerm (authority = ISO 639-3:2007); (type = text)
English
PhysicalDescription
InternetMediaType
application/pdf
Extent
21 p.
Subject (authority = LCSH)
Topic
Spin coating
Subject (authority = local)
Topic
Thickness
Subject (authority = LCSH)
Topic
Thin films
Subject (authority = LCSH)
Topic
Acceleration (Mechanics)
RelatedItem (type = host)
TitleInfo
Title
Birnie, Dunbar
Identifier (type = local)
rucore30144400001
Extension
DescriptiveEvent
Type
Grant
AssociatedEntity
Role
Funder
Name
National Science Foundation
AssociatedEntity
Role
Originator
Name
Dunbar P. Birnie
AssociatedObject
Type
Grant number
Name
DMR 98-02334
Detail
Support from the National Science Foundation under grant DMR 98-02334: Dye Probe Studies of Spin Coating of Sol-Gel Solutions.
Extension
DescriptiveEvent
Type
Citation
DateTime (encoding = w3cdtf)
2005
AssociatedObject
Type
Journal
Relationship
Has part
Name
Journal of Materials Science: Materials in Electronics
Identifier (type = volume and issue)
16(11-12)
Reference (type = digital)
http://dx.doi.org/10.1007/s10854-005-4973-6
Detail
3993-3997
Location
PhysicalLocation (authority = marcorg); (displayLabel = Rutgers, The State University of New Jersey)
NjNbRU
Identifier (type = doi)
doi:10.7282/T3JM27RS
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Rights

RightsHolder (type = corporate)
Name
Springer Science + Business Media, Inc.
Role
Copyright holder
RightsDeclaration (AUTHORITY = FS); (ID = rulibRdec0004)
Copyright for scholarly resources published in RUcore is retained by the copyright holder. By virtue of its appearance in this open access medium, you are free to use this resource, with proper attribution, in educational and other non-commercial settings. Other uses, such as reproduction or republication, may require the permission of the copyright holder.
Copyright
Status
Copyright protected
Availability
Status
Open
Reason
Permission or license
RightsEvent
Type
Permission or license
AssociatedObject
Type
License
Name
Multiple author license v. 1
Detail
I hereby grant to Rutgers, The State University of New Jersey (Rutgers) the non-exclusive right to retain, reproduce, and distribute the deposited work (Work) in whole or in part, in and from its electronic format, without fee. This agreement does not represent a transfer of copyright to Rutgers.Rutgers may make and keep more than one copy of the Work for purposes of security, backup, preservation, and access and may migrate the Work to any medium or format for the purpose of preservation and access in the future. Rutgers will not make any alteration, other than as allowed by this agreement, to the Work.I represent and warrant to Rutgers that the Work is my original work. I also represent that the Work does not, to the best of my knowledge, infringe or violate any rights of others.I further represent and warrant that I have obtained all necessary rights to permit Rutgers to reproduce and distribute the Work and that any third-party owned content is clearly identified and acknowledged within the Work.By granting this license, I acknowledge that I have read and agreed to the terms of this agreement and all related RUcore and Rutgers policies.
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Technical

RULTechMD (ID = TECHNICAL1)
ContentModel
Manuscript
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