TY - JOUR TI - Residual stress in ceramic and semiconducting materials DO - https://doi.org/doi:10.7282/T34J0J82 PY - 2017 AB - Machining of ceramic, semiconductor, and single crystal materials is almost always necessary, but is the most damaging , as well as the most expensive , step of material production. In order for there to be continued progress towards more advanced materials, more advanced machining techniques are necessary. In this study, one such technique that is a derivative of Single Point Diamond Turning (SPDT), Micro Laser-Assisted Machining, or Micro-LAM, is examined. Three main thrusts were looking at silicon machined with a load-controlled machine, silicon machined with an ultra-high precision machine, and sapphire. Micro-Raman spectroscopy was used to evaluate these materials for residual stress, relative phase purity, and relative crystallinity, all of which can be affected negatively by machining processes. It was found that Micro-LAM produces excellent results. When the laser power was optimized, it allowed for materials with low residual stress, high relative phase purity and relative crystallinity, as well as excellent surface finishes. Furthermore, Micro-LAM was found to be superior to traditional SPDT due to the addition of laser assistance. These results are discussed, as well as the impact of changing the machining parameters on the resulting material. KW - Materials Science and Engineering KW - Ceramic materials--Machining KW - Residual stresses LA - eng ER -