DescriptionIn this research work, silicon microchannels are studied for computational analysis of heat transfer and fluid flow characteristics. Different designs of silicon microchannels were modeled and simulated in ANSYS FLUENT, evaluating thermal distributions for various boundary conditions. The operating parameters were inlet velocity, inlet temperature, and geometric configurations, under a constant surface heat flux condition. Microchannel cooling enhances heat transfer coefficients, thus allowing a high-power capacity. For a high heat-dissipating system, liquids provide better efficiency and capacity than air as a coolant. Hence water is used as the working medium in the microchannels.
Fabrication of silicon substrates prefers the rectangular geometry for microchannel design. For efficient design, geometric configurations considered in the modeling are varied from 100 x 50um to 500 x 200um. The length of microchannels fluctuates in between 1mm and 4.5mm.
The configurations considered were, Straight, U-shaped and Serpentine microchannels. Straight microchannels observed the best fluid flow characteristics. U-shaped microchannels had an increased pressure drop in the channels, but it showed better heat transfer characteristics than straight microchannels. The most effective in terms of heat transfer characteristics were the Serpentine microchannels. Straight microchannel showed an optimized heat transfer and fluid flow characteristics. Hence variations in it were verified for improved cooling performance. Based on the analysis, there is enhanced heat transfer rates at the cost of a massive pressure drop.