Kareem, Muthanna K.. Mechanical characterization of thin film oligomeric silsesquioxane polymer coated on silicon substrate with nanoindentation measurements. Retrieved from https://doi.org/doi:10.7282/T3M90CVJ
DescriptionNanoindentation measurements were carried out using coatings of oligomeric silsesquioxane polymer (melting gel) (Tc: 150℃) deposited by blade (knife coating) technology on a silicon substrate. Consequently, the blade specimens were heated to different temperatures on a hot plate. This experimental protocol enables the study of kinetic principles pertinent to different experimental conditions and their effects on the final morphologies of melting gel films. The mechanical properties of the thin oligomeric silsesquioxane polymer film on a silicon substrate are evaluated using nanoindentation. A wide range of loads is applied by employing a Hysitron TI-750 Ubi nanoindenter. The instrument utilizes a Berkovich indenter, and during experimentation, the maximum penetration depth is limited up to 10% of the film thickness to avoid unintentional probing of the substrate properties. Load and depth control nanoindentation experiments enabled the quantitative determination of localized mechanical properties such as Young's modulus and hardness. The morphology and surface roughness of the specimens were also accounted in the result interpretation.